HARMAN Hiring 2026: Embedded & Automotive Systems Intern | Bengaluru (Job ID R-56067-2026)

Company: HARMAN International (A Samsung Company)
Job Title: Intern – Embedded Systems & Automotive Software
Job Requisition ID: R-56067-2026
Career Level: T0 (Intern / Trainee)
Employment Type: Fixed Term Intern (Trainee)
Work Arrangement: Hybrid (HARMAN FlexConnect Program — Minimum 3 days in-office)
Target Discipline: B.E. / B.Tech in Computer Science, Electronics Engineering (Completed or Ongoing)
Location: Sattva Knowledge Court, Bengaluru, Karnataka, India

HARMAN, a wholly-owned subsidiary of Samsung Electronics, is an automotive and consumer electronics leader developing connected car platforms, digital cockpit architectures, and enterprise audio solutions across brands like JBL, Mark Levinson, and AKG.

The Embedded Systems & Automotive Software Intern role is based at HARMAN’s technology campus in Sattva Knowledge Court, Bengaluru. This position focuses on multi-layered automotive software stacks, combining C/C++, Linux, Embedded RTOS, and CAN bus protocols to build innovative Proofs of Concept (PoCs), accelerators, and embedded automotive platforms.

• Embedded Software Engineering: Design, code, debug, and troubleshoot multi-layered software systems using C, C++, and Linux environments.
• Automotive Architecture & CAN Protocol: Support development and testing of embedded automotive systems, leveraging Controller Area Network (CAN) bus protocols and automotive software interfaces.
• PoC & Accelerator Prototyping: Ideate, construct, and demonstrate innovative PoCs, demonstrable prototypes, software accelerators, and IP frameworks in emerging technology domains.
• Testing & System Debugging: Perform hands-on code development, unit testing, and hardware/software debugging using emulators, simulators, and logic analyzers.
• Agile & Process Improvement: Participate in continuous improvement initiatives, applying original thinking to optimize internal development frameworks and adapt to changing automotive standards.

Academic Background

• Degree: Pursuing or completed a Bachelor of Engineering (B.E.) or Bachelor of Technology (B.Tech) in Computer Science Engineering (CSE), Electronics & Communication Engineering (ECE), or related streams.
• Curriculum Alignment: Suitable for students seeking mandatory curriculum internships or graduates wanting short-term corporate engineering exposure.

Mandatory Technical Skills

• Core Programming Languages: Strong foundational coding skills and active interest in C and C++.
• Operating Systems: Practical understanding of Linux command-line tools and operating system principles.
• Embedded & Automotive Concepts: Basic familiarity with CAN bus, embedded systems, or automotive electronics workflows.

Desirable Skills & Personal Traits

• Exposure to Embedded RTOS (Real-Time Operating Systems) and Android OS architecture.
• Strong problem-solving mindset, technical troubleshooting capabilities, and clear written/verbal English communication.

• Estimated Internship Stipend: ₹30,000 to ₹45,000 per month, depending on degree level (ongoing vs. completed B.Tech) and interview evaluation.
• Corporate Benefits:
  • HARMAN FlexConnect: Hybrid work policy offering flexibility with a minimum 3 in-office days at Sattva Knowledge Court campus.
  • Mentorship from senior automotive architects and embedded domain leads.
  • Direct experience in building patent-ready intellectual property (IP) and real-world automotive prototypes.

1. Profile Application & Screening (Job ID: R-56067-2026)
   (Verification of CS/ECE degree background, C/C++ basics, & Bengaluru location availability)
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2. Online Technical Screening & Aptitude Assessment
   (Evaluation of C/C++ syntax, logic building, Linux commands, & basic electronics)
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3. Technical Interview Round 1 (C/C++ & Operating Systems)
   (Deep dive into pointers, memory management, Linux OS concepts, & academic projects)
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4. Technical Interview Round 2 (Embedded Systems, CAN & Automotive Logic)
   (Discussion on CAN bus architecture, RTOS tasks, debugging scenarios, & PoC ideation)
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5. HR & Cultural Fit Discussion

• C / C++ Core Concepts: Pointers, structure alignment, volatile qualifiers, dynamic memory allocation (malloc, free, new, delete), bitwise operations, and object-oriented design.
• Automotive & CAN Bus Basics: CAN frame structure, message arbitration, baud rates, differential signaling (CAN High/Low), and diagnostic OBD-II fundamentals.
• Embedded OS Fundamentals: Interrupt Handling (ISR), process vs. thread management, Linux system calls, mutexes/semaphores, and memory layout (Heap vs. Stack).

• Programming & Systems: C, C++, Linux, Embedded RTOS, Software System Development, Multi-Layered Software Stack, Android OS
• Automotive & Hardware: CAN Bus, Automotive Systems, Microcontrollers, Code Troubleshooting, Code Debugging, Emulators, Simulators
• Prototyping & Innovation: Proof of Concept (PoC), Software Accelerators, Frameworks, IP Generation, Prototypes, Process Improvement
• Soft Skills & Workflows: HARMAN FlexConnect, Problem Solving, Technical Documentation, Cross-Functional Teamwork

1. What is the Job Requisition ID for this internship?

The official HARMAN job requisition ID is R-56067-2026.

2. Where is the job location?

The position is located at HARMAN Automotive, Sattva Knowledge Court Building, Bengaluru, Karnataka, India.

3. Are ongoing B.E. / B.Tech students eligible to apply?

Yes. The posting explicitly notes that candidates who are currently pursuing or have completed their B.E./B.Tech degrees are eligible.

4. What key automotive protocol is mentioned in the job description?

Knowledge of the CAN (Controller Area Network) protocol is explicitly highlighted under preferred technical fit skills.