HARMAN Hiring 2026: Embedded & Software Engineering Intern | Bengaluru (Job ID R-56145-2026)

Company: HARMAN International (A Samsung Company)
Job Title: Intern – Software Engineering & Embedded Systems
Job Requisition ID: R-56145-2026
Career Level: T0 (Intern / Trainee)
Employment Type: Fixed Term Intern (Trainee)
Work Arrangement: Hybrid (HARMAN FlexConnect Program — Minimum 3 days in-office)
Target Discipline: B.E. / B.Tech in Computer Science or Electronics Engineering
Location: Sattva Knowledge Court, Bengaluru, Karnataka, India

HARMAN, a wholly-owned subsidiary of Samsung Electronics, is a global leader in automotive technology, connected car systems, lifestyle audio solutions, and digital transformation services. Operating through world-renowned audio and technology brands (such as JBL, Mark Levinson, and Revel), HARMAN develops integrated technology platforms that make driving safer, smarter, and more connected.

The Software Engineering & Embedded Systems Intern position provides students and recent graduates with hands-on exposure to multi-layered automotive software stacks. Located at HARMAN’s engineering facility in Sattva Knowledge Court, Bengaluru, this internship offers direct training across Embedded RTOS, Linux, Android Automotive/Basics, and low-level C/C++ programming.

• Software Development & Coding: Participate in code development, feature implementation, and maintenance across multi-layered software stacks using C, C++, and Linux environments.
• Embedded & Automotive Systems: Assist in engineering software components targeting Embedded Real-Time Operating Systems (RTOS) and Linux-based platforms.
• Software Testing & Debugging: Learn to test, debug, and troubleshoot embedded software modules using hardware debuggers, emulators, and simulators.
• Release & Quality Assurance: Support software build releases, versioning, and software quality assurance (SQA) activities within an active engineering workflow.
• Continuous Process Improvement: Apply innovative problem solving and original thinking to optimize internal development processes and adapt to evolving automotive software standards.

Academic Background

• Degree: Pursuing or recently completed a Bachelor of Engineering (B.E.) or Bachelor of Technology (B.Tech) in Computer Science (CS), Electronics & Communication Engineering (ECE), or related electronics streams.
• Requirement Fit: Open to students where internship is a mandatory curriculum requirement or fresh graduates seeking short-term corporate engineering exposure.

Mandatory Technical Skills

• Core Programming: Fundamental coding ability and interest in C and C++.
• Operating Systems: Basic technical understanding of Linux environments and command-line interfaces.
• Software Debugging: Hands-on willingness to learn code troubleshooting, debugging, and testing using emulators/simulators.
• Soft Skills: Good verbal and written communication, positive team attitude, and high learning agility.

Desirable / Good-to-Have Skills

• Basic knowledge of Android OS architecture or Android application/framework development.
• Understanding of Embedded RTOS concepts (tasks, scheduling, inter-process communication).
• General awareness of automotive technology trends and modern embedded software lifecycles.

• Estimated Internship Stipend: ₹30,000 to ₹45,000 per month, depending on degree level, technical interview assessment, and duration.
• Corporate Benefits:
  • HARMAN FlexConnect: Modern hybrid work policy (minimum 3 days per week at Sattva Knowledge Court campus).
  • Direct mentorship from senior automotive software architects and embedded engineers.
  • Exposure to Tier-1 automotive software platforms and Samsung ecosystem projects.
  • Potential conversion pathways to full-time engineering roles (PPO/FTE) upon successful internship evaluation.

1. Application Screening & Shortlisting (Job ID: R-56145-2026)
   (Verification of CS/ECE degree background, C/C++ basics, & Bengaluru location fit)
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2. Technical Online Screening / Coding Assessment
   (Questions evaluating C/C++ syntax, data structures, pointer manipulation, & basic OS concepts)
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3. Technical Interview Round 1 (C/C++ & Operating Systems)
   (Deep dive into pointers, memory management, Linux command-line, & academic projects)
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4. Technical Interview Round 2 (Embedded Concepts & Problem Solving)
   (Questions on RTOS basics, debugging tools, Android concepts, & code troubleshooting logic)
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5. HR & Onboarding Discussion

• C / C++ Fundamentals: Pointers, dynamic memory allocation (malloc/free, new/delete), structures, object-oriented concepts, volatile keyword, and bitwise operations.
• Linux & Operating System Basics: Process management, threads, file permissions, IPC mechanisms (pipes, message queues), and basic Linux terminal commands.
• Embedded System Basics: Microcontroller memory layout (Stack, Heap, Data, BSS), interrupt handling, RTOS scheduling, and emulator/debugger usage.

• Software Development: C, C++, Linux, Software Engineering, Code Development, Code Debugging, Software Testing, Software Quality Assurance
• Embedded Systems: Embedded RTOS, Real-Time Operating Systems, Emulators, Simulators, Debuggers, Microcontroller Systems
• Platforms & Concepts: Android Basics, Android Framework, Multi-Layered Software Stack, Automotive Systems, Process Improvement
• Workflows & Soft Skills: Troubleshooting, Technical Documentation, Team Collaboration, Communication Skills, HARMAN FlexConnect

1. What is the official Job Requisition ID for this internship?

The official HARMAN job requisition ID is R-56145-2026.

2. Where is the job location for this role?

The role is located at HARMAN Automotive, Sattva Knowledge Court Building, Bengaluru, Karnataka, India.

3. What is the work model for this internship?

HARMAN operates under the FlexConnect Program, offering a flexible hybrid model requiring a minimum of three in-office days per week.

4. Is prior experience in Android or RTOS mandatory?

No. Basic understanding of C, C++, and Linux is required, while Android basics and RTOS knowledge are considered desirable bonus skills.